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1．SCOPE
This specification shall cover the characteristics of the ceramic resonator ZTTCS and ZTTCV
2．PART NO.
|
PART NUMBER |
PREVIOUS PART NUMBER |
|
ZTTCS and ZTTCV |
ZTTCS and ZTTCV |
|
CUSTOMER PART NO |
SPECIFICATION NO |
|
|
|
3．OUTLINE DIMENSIONS AND MARK
3.1 Appearance: No visible damage and dirt.
3.2 Construction: SMD ceramic packaging.
3.3 The products conform to the RoHS directive and national environment protection law.
3.4 Dimensions and mark
4．ELECTRICAL SPECIFICATIONS
4.1 RATING
|
Items |
Requirement |
|
Withstanding Voltage (V) |
50 (DC，1min) |
|
Insulation Resistance Ri,（MΩ）min. |
100 （10V，1min） |
|
Operating temperature |
-25℃～85℃ |
|
Storage temperature |
-55℃～85℃ |
|
Rating Voltage UR（V） |
6V DC |
|
15V p-p |
4.2 ELECTRICAL SPECIFICATIONS
|
Items |
Requirement |
|
Oscillation Frequency Fosc（MHz） |
24.000 |
|
Frequency Accuracy （%） |
±0.5 |
|
Resonant Impedance Ro（Ω）max. |
40 |
Temperature Coefficient of OscillationFrequency （%） max. |
±0.3（Oscillation Frequency drift，-25℃～+85℃） |
|
Oscillation Frequency Aging Rate (%) max * |
±0.3 (From initial value) |
* Components shall be left in a chamber of +85±2℃ for 1000 hours, then measured after leaving in natural condition for 1 hours.
5．TEST
5.1 Test Conditions
Parts shall be tested under the condition ( Temp.：20±15℃,Humidity ：65±20%
R.H.) unless the standard condition(Temp.：25±2℃,Humidity ：65±5% R.H.)
i
IC:
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X:
Ceramic Resonator
5.2 Test Circuit
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
|
No |
Item |
Condition of Test |
Performance Requirements |
|
|
6.1 |
Humidity |
Keep the resonator at 40℃±2℃ and 90%-95% RH for 96h. Then Release the resonator into the room Condition for 1h prior to the Measurement. |
It shall fulfill the specifications in Table 1. |
|
|
6.2 |
High Temperature Exposure |
Subject the resonator to 85℃±2℃ for 96h, then release the resonator into the room conditions for 1h prior to the measurement. |
It shall fulfill the specifications in Table 1. |
|
|
6.3 |
Low Temperature Exposure |
Subject the resonator to -55℃±2℃ for 96h, then release the resonator into the room conditions for 1h prior to the measurement. |
It shall fulfill the specifications in Table 1. |
|
|
6.4 |
Temperature Cycling |
After temperature cycling of blow table was performed 5 times, resonator shall be measured after being placed in natural conditions for 1h. |
It shall fulfill the specifications in Table 1. |
|
|
Temperature |
Time |
|||
|
–25±3℃ |
30±3 min |
|||
|
85±3℃ |
30±3 min |
|||
|
6.5 |
Vibration |
Subject the resonator to vibration for 2h each in x、y and z axis With the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 Hz—55Hz. |
It shall fulfill the specifications in Table 1. |
|
|
6.6 |
Mechanical Shock |
Drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. |
It shall fulfill the specifications in Table 1. |
|
|
6.7
|
Soldering Test |
Passed through the re-flow oven under the following condition and left at room temperature for 1h before measurement. |
It shall fulfill the specifications in Table 1. |
|
|
|
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（To be continued）
6 PHYSICAL AND ENVIRONMENAL CHARACTERISICS
|
No |
Item |
Condition of Test |
Performance Requirements |
|
6.8 |
Solder Ability |
Dipped in 245℃±5℃ solder bath for 3s±0.5 s with rosin flux (25wt% ethanol solution.) |
The terminals shall be at least 95% covered by solder. |
|
6.9 |
Board Bending |
Mount a glass-epoxy board (Width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (See the following figure)
|
Mechanical damage such as breaks shall not occur. |
Table 1
|
Item |
Specification after test |
|
Oscillation Frequency Change Δfosc/fosc （%）max. |
±0.3 |
|
Resonant Impedance Ro（Ω）max. |
45 |
|
The limits in the above table are referenced to the initial measurements. |
|
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS
7.1Recommended land pattern
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7.2Recommended reflow soldering standard conditions
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8．PACKAGE
To protect the products in storage and transportation，it is necessary to pack them（outer and inner package）.
8.1 On paper pack, the following requirements are requested.
8.1.1 Dimensions and Mark
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|
NO. |
Name |
Quantity |
|
① |
Package |
1 |
|
② |
Inner Box |
12 |
|
③ |
Belt |
2.9 m |
|
④ |
Adhesive tape |
1.2 m |
|
⑤ |
Label |
1 |
|
⑥ |
Certificate of approval |
1 |
|
⑦ |
Company name ,Address etc. |
|
8.1.2 Section of package
Package is made of corrugated paper with thickness of 0.8cm.Package has 12 inner boxes, each box has 5reels(each reel for plastic bag)
8.1.3 Quantity of package
Per plastic reel 1000 pieces of piezoelectric ceramic part
Per inner box 5 reels
Per package 12 inner boxes
（60000 pieces of piezoelectric ceramic part ）
8.1.4 Inner Box Dimensions
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|
NO. |
Name |
Quantity |
|
① |
Inner Box |
1 |
|
② |
QC Label |
1 |
|
③ |
Label |
1 |
8.2 On reel pack, the following requirements are requested.
8.2.1 Reel Dimensions
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|
φA |
φB |
W |
T |
Pieces per reel |
Carrier tape size |
|
180±3 |
60min |
12.4min |
19.4max |
1000typ. |
12 |
8.2.3 Packing Method Sketch Map
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8.2.4Test Condition Of Peeling Strength
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9．EIAJ Monthly Code
|
2005 / 2007 / 2009 |
2006 / 2008 / 2010 |
||
|
MONTH |
CODE |
MONTH |
CODE |
|
JAN |
A |
JAN |
N |
|
FEB |
B |
FEB |
P |
|
MAR |
C |
MAR |
Q |
|
APR |
D |
APR |
R |
|
MAY |
E |
MAY |
S |
|
JUN |
F |
JUN |
T |
|
JUL |
G |
JUL |
U |
|
AUG |
H |
AUG |
V |
|
SEP |
J |
SEP |
W |
|
OCT |
K |
OCT |
X |
|
NOV |
L |
NOV |
Y |
|
DEC |
M |
DEC |
Z |
10．OTHER
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